View LIS302DLTR8_110338.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

LIS302DL
MEMS motion sensor 3-axis - 2g/8g smart digital output "piccolo" accelerometer
Feature

2.16V to 3.6V supply voltage 1.8V compatible IOs <1mW power consumption 2g / 8g dynamically selectable full-scale I2C/SPI digital output interface Programmable multiple interrupt generator Click and double click recognition Embedded high pass filter Embedded self test 10000g high shock survivability ECOPACK(R) RoHS and "Green" compliant (see Section 9) process developed by ST to produce inertial sensors and actuators in silicon. The IC interface is manufactured using a CMOS process that allows to design a dedicated circuit which is trimmed to better match the sensing element characteristics. The LIS302DL has dynamically user selectable full scales of 2g/8g and it is capable of measuring accelerations with an output data rate of 100Hz or 400Hz. A self-test capability allows the user to check the functioning of the sensor in the final application. The device may be configured to generate inertial wake-up/free-fall interrupt signals when a programmable acceleration threshold is crossed at least in one of the three axes. Thresholds and timing of interrupt generators are programmable by the end user on the fly. The LIS302DL is available in plastic Thin Land Grid Array package (TLGA) and it is guaranteed to operate over an extended temperature range from -40C to +85C.
LGA-14 (3x5x0.9mm)
Application

Free-Fall detection Motion activated functions Gaming and virtual reality input devices Vibration monitoring and compensation
Description
The LIS302DL is an ultra compact low-power three axes linear accelerometer. It includes a sensing element and an IC interface able to provide the measured acceleration to the external world through I2C/SPI serial interface. The sensing element, capable of detecting the acceleration, is manufactured using a dedicated Table 1. Device summary
Temp range, C -40 to +85 -40 to +85 -40 to +85
Part number LIS302DL LIS302DLTR LIS302DLTR8
Package LGA LGA LGA
Packing Tray Tape and reel (5000 pcs/reel) Tape and reel (8000 pcs/reel)
October 2007
Rev 3
1/42
www.st.com 1
Contents
LIS302DL
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1 1.2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2
Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . 10
2.1 2.2 2.3 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3.1 2.3.2 SPI - Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 I2C - inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4 2.5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.5.1 2.5.2 2.5.3 2.5.4 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Self test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Click and Double Click recognition . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3
Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1 3.2 3.3 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4
Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5
Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.1 5.2 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.1.1 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2.1 5.2.2 5.2.3 SPI Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SPI Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SPI Read in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
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LIS302DL
Contents
6 7
Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 7.15 7.16 7.17 7.18 7.19 7.20 7.21 7.22 7.23 7.24 WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 CTRL_REG1 (20h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 CTRL_REG2 (21h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 CTRL_REG3 [Interrupt CTRL register] (22h) . . . . . . . . . . . . . . . . . . . . . . 28 HP_FILTER_RESET (23h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 STATUS_REG (27h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 OUT_X (29h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 OUT_Y (2Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 OUT_Z (2Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 FF_WU_CFG_1 (30h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 FF_WU_SRC_1 (31h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 FF_WU_THS_1 (32h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 FF_WU_DURATION_1 (33h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 FF_WU_CFG_2 (34h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 FF_WU_SRC_2 (35h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 FF_WU_THS_2 (36h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 FF_WU_DURATION_2 (37h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 CLICK_CFG (38h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 CLICK_SRC (39h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 CLICK_THSY_X (3Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 CLICK_THSZ (3Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 CLICK_TimeLimit (3Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 CLICK_Latency (3Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 CLICK_Window (3Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8
Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.1 8.2 8.3 Mechanical characteristics at 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Mechanical characteristics derived from measurement in the -40C to +85C temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Electro-mechanical characteristics at 25C . . . . . . . . . . . . . . . . . . . . . . . 39
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Contents
LIS302DL
9 10
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
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LIS302DL
List of tables
List of tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. Table 45. Table 46. Table 47. Table 48. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 SPI slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 I2C slave timing values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SAD+read/write patterns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Transfer when master is writing one byte to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Transfer when Master is writing multiple bytes to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Transfer when master is receiving (reading) one byte of data from slave . . . . . . . . . . . . . 20 Transfer when master is receiving (reading). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Multiple bytes of data from slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Register address map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 High pass filter cut-off frequency configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Register desccription . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
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List of tables Table 49. Table 50. Table 51. Table 52. Table 53. Table 54. Table 55. Table 56. Table 57. Table 58. Table 59.
LIS302DL
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
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LIS302DL
List of figures
List of figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 SPI slave timing diagram (2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 I2C slave timing diagram (4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 LIS302DL electrical connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SPI Read protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Multiple bytes SPI Read protocol (2 bytes example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SPI Write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Multiple bytes SPI Write protocol (2 bytes example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 SPI Read protocol in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 X axis 0-g level at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 X axis sensitivity at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Y axis 0-g level at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Y axis sensitivity at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Z axis 0-g level at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Z axis sensitivity at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 X axis 0-g level change vs temperature at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 X axis Sensitivity change vs temperature at 2.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Y axis 0-g level change vs temperature at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Y axis sensitivity change Vs temperature at 2.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Z axis 0-g level change vs temperature at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Z axis sensitivity change vs temperature at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Current consumption in normal mode at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Current consumption in power down mode at 2.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 LGA 14: Mechanical data and package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
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Block diagram and pin description
LIS302DL
1
1.1
Figure 1.
Block diagram and pin description
Block diagram
Block diagram
X+ Y+ Z+
CHARGE AMPLIFIER
MUX A/D CONVERTER CONTROL LOGIC
CS I2C SPI SCL/SPC SDA/SDO/SDI SDO
a
ZYX-
SELF TEST
REFERENCE
TRIMMING CIRCUITS
CLOCK
CONTROL LOGIC
&
INT 1 INT 2
INTERRUPT GEN.
1.2
Pin description
Figure 2. Pin connection
Z Y
1
X
1
6
6 8
13
13
8
TOP VIEW
BOTTOM VIEW
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LIS302DL Table 2.
Pin# 1 2 3 4 5 6 7 8 9 10 11 12
Block diagram and pin description Pin description
Name Vdd_IO GND Reserved GND GND Vdd CS INT 1 INT 2 GND Reserved SDO SDA SDI SDO SCL SPC Power supply for I/O pins 0V supply Connect to Vdd 0V supply 0V supply Power supply SPI enable I2C/SPI mode selection (1: I2C mode; 0: SPI enabled) Inertial interrupt 1 Inertial interrupt 2 0V supply Connect to Gnd SPI Serial data output I2C less significant bit of the device address I2C Serial Data (SDA) SPI Serial Data Input (SDI) 3-wire Interface Serial Data Output (SDO) I2C Serial Clock (SCL) SPI Serial Port Clock (SPC) Function
13
14
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Mechanical and electrical specifications
LIS302DL
2
2.1
Table 3.
Symbol FS
Mechanical and electrical specifications
Mechanical characteristics
Mechanical characteristics(1) (2)
Parameter Measurement range(4) Test conditions FS bit set to 0 FS bit set to 1 FS bit set to 0 FS bit set to 1 FS bit set to 0 FS bit set to 0 FS bit set to 1 Max delta from 25C FS bit set to 0 STP bit used X axis Vdd=2.16V to 3.6V Self test output change(7),(8),(9) FS bit set to 0 STP bit used Y axis Vdd=2.16V to 3.6V FS bit set to 0 STP bit used Z axis Vdd=2.16V to 3.6V BW Top Wh System bandwidth(10) Operating temperature range Product weight -40 30 Min. 2.0 8.0 16.2 64.8 Typ.(3) 2.3 9.2 18 72 0.01 40 60 0.5 19.8 79.2 Max. Unit g
So TCSO TyOff TCOff
Sensitivity Sensitivity change vs temperature Typical zero-g level offset accuracy(5),(6) Zero-g level change vs temperature
mg/digit %/C mg mg mg/C
-16
-3
LSb
Vst
3
16
LSb
3
16
LSb
ODR/2 +85
Hz C mgram
1. The product is factory calibrated at 2.5V. The device can be used from 2.16V to 3.6V 2. All the parameters are specified @ Vdd=2.5V, T = 25C unless otherwise noted 3. Typical specifications are not guaranteed 4. Verified by wafer level test and measurement of initial offset and sensitivity 5. Typical zero-g level offset value after MSL3 preconditioning 6. Offset can be eliminated by enabling the built-in high pass filter 7. If STM bit is used values change in sign for all axes 8. Self Test output changes with the power supply. "Self test output change" is defined as OUTPUT[LSb](Self-test bit on ctrl_reg1=1) -OUTPUT[LSb](Self-test bit on ctrl_reg1=0). 1LSb=4.6g/256 at 8bit representation, 2.3g Full-Scale 9. Output data reach 99% of final value after 3/ODR when enabling Self-Test mode due to device filtering 10. ODR is output data rate. Refer to Table 4 for specifications
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LIS302DL
Mechanical and electrical specifications
2.2
Table 4.
Symbol Vdd Vdd_IO Idd IddPdn VIH VIL VOH VOL
Electrical characteristics
Electrical characteristics(1) (2)
Parameter Supply voltage I/O pins supply voltage(4) Supply current Current consumption in power-down mode Digital high level input voltage Digital low level input voltage High level output voltage Low level output voltage DR=0 100 Hz DR=1 400 ODR/2 3/ODR -40 +85 Hz s 0.9*Vdd _IO 0.1*Vdd _IO T = 25C, ODR=100Hz T = 25C 0.8*Vdd _IO 0.2*Vdd _IO Test conditions Min. 2.16 1.71 0.3 1 Typ.(3) 2.5 Max. 3.6 Vdd+0.1 0.4 5 Unit V V mA A V V V V
ODR BW Ton Top
Output data rate System bandwidth(5) Turn-on time(6)
Operating temperature range
C
1. The product is factory calibrated at 2.5V. The device can be used from 2.16V to 3.6V 2. All the parameters are specified @ Vdd=2.5V, T= 25C unless otherwise noted 3. Typical specification are not guaranteed 4. It is possible to remove Vdd maintaining Vdd_IO without blocking the communication busses, in this condition the measurement chain is powered off. 5. Filter cut-off frequency 6. Time to obtain valid data after exiting Power-Down mode
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Mechanical and electrical specifications
LIS302DL
2.3
2.3.1
Communication interface characteristics
SPI - Serial Peripheral Interface
Subject to general operating conditions for Vdd and top. Table 5.
Symbol tc(SPC) fc(SPC) tsu(CS) th(CS) tsu(SI) th(SI) tv(SO) th(SO) tdis(SO) SPI clock cycle SPI clock frequency CS setup time CS hold time SDI input setup time SDI input hold time SDO valid output time SDO output hold time SDO output disable time 6 50 5 8 5 15 50 ns
SPI slave timing values
Value (1) Parameter Min 100 10 Max ns MHz Unit
Figure 3.
SPI slave timing diagram (2)
CS
(3)
(3)
tsu(CS)
tc(SPC)
th(CS)
(3)
SPC
(3)
tsu(SI)
th(SI)
MSB IN LSB IN (3)
SDI
(3)
tv(SO)
th(SO)
LSB OUT
tdis(SO)
(3)
SDO
(3)
MSB OUT
1. Values are guaranteed at 10MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not tested in production 2. Measurement points are done at 0.2*Vdd_IO and 0.8*Vdd_IO, for both Input and Output port 3. When no communication is on-going, data on CS, SPC, SDI and SDO are driven by internal pull-up resistors
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LIS302DL
Mechanical and electrical specifications
2.3.2
I2C - inter IC control interface
Subject to general operating conditions for Vdd and top. Table 6.
Symbol f(SCL) tw(SCLL) tw(SCLH) tsu(SDA) th(SDA) tr(SDA) tr(SCL) tf(SDA) tf(SCL) th(ST) tsu(SR) tsu(SP) tw(SP:SR)
I2C slave timing values
I2C Standard mode (1) Parameter Min Max 100 Min 0 1.3 s 0.6 100 3.45(2) 1000 300 4 4.7 4 4.7 0 20 + 0.1Cb (3) 20 + 0.1Cb (3) 0.6 0.6 s 0.6 1.3 0.9(2) 300 ns 300 ns s Max 400 KHz I2C Fast mode (1) Unit 0 4.7 4.0 250 0
SCL clock frequency SCL clock low time SCL clock high time SDA setup time SDA data hold time SDA and SCL rise time SDA and SCL fall time START condition hold time Repeated START condition setup time STOP condition setup time Bus free time between STOP and START condition
Figure 4.
I2C slave timing diagram (4)
REPEATED START
START tsu(SR)
SDA
tw(SP:SR)
START
tf(SDA)
tr(SDA)
tsu(SDA)
th(SDA) tsu(SP) STOP
SCL
th(ST)
tw(SCLL)
tw(SCLH)
tr(SCL)
tf(SCL)
1. Data based on standard I2C protocol requirement, not tested in production 2. A device must internally provide an hold time of at least 300ns for the SDA signal (referred to VIHmin of the SCL signal) to bridge the undefined region of the falling edge of SCL 3. Cb = total capacitance of one bus line, in pF 4. Measurement points are done at 0.2*Vdd_IO and 0.8*Vdd_IO, for both port
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Mechanical and electrical specifications
LIS302DL
2.4
Absolute maximum ratings
Stresses above those listed as "absolute maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 7.
Symbol Vdd Vdd_IO Vin Supply voltage I/O pins supply voltage Input voltage on any control pin (CS, SCL/SPC, SDA/SDI/SDO) Acceleration (any axis, powered, Vdd=2.5V) 10000g for 0.1 ms 3000g for 0.5 ms AUNP TOP TSTG ESD Acceleration (any axis, unpowered) 10000g for 0.1 ms Operating temperature range Storage temperature range Electrostatic discharge protection -40 to +85 -40 to +125 4 (HBM) 1.5 (CDM) 200 (MM) C C kV kV V
Absolute maximum ratings
Ratings Maximum Value -0.3 to 6 -0.3 to 6 -0.3 to Vdd_IO +0.3 3000g for 0.5 ms Unit V V V
APOW
Note:
Supply voltage on any pin should never exceed 6.0V This is a Mechanical Shock sensitive device, improper handling can cause permanent damages to the part This is an ESD sensitive device, improper handling can cause permanent damages to the part
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LIS302DL
Mechanical and electrical specifications
2.5
2.5.1
Terminology
Sensitivity
Sensitivity describes the gain of the sensor and can be determined e.g. by applying 1g acceleration to it. As the sensor can measure DC accelerations this can be done easily by pointing the axis of interest towards the center of the Earth, noting the output value, rotating the sensor by 180 degrees (point to the sky) and noting the output value again. By doing so, 1g acceleration is applied to the sensor. Subtracting the larger output value from the smaller one and dividing the result by 2 leads to the actual sensitivity of the sensor. This value changes very little over temperature and also very little over time. The Sensitivity Tolerance describes the range of Sensitivities of a large population of sensor.
2.5.2
Zero-g level
Zero-g level Offset (Off) describes the deviation of an actual output signal from the ideal output signal if there is no acceleration present. A sensor in a steady state on a horizontal surface will measure 0g in X axis and 0g in Y axis whereas the Z axis will measure 1g. The output is ideally in the middle of the dynamic range of the sensor (content of OUT registers 00h, data expressed as 2's complement number). A deviation from ideal value in this case is called Zero-g offset. Offset is to some extent a result of stress to a precise MEMS sensor and therefore the offset can slightly change after mounting the sensor onto a printed circuit board or exposing it to extensive mechanical stress. Offset changes little over temperature, see "Zero-g level change vs. temperature". The Zero-g level of an individual sensor is stable over lifetime. The Zero-g level tolerance describes the range of Zero-g levels of a population of sensors.
2.5.3
Self test
Self Test allows to check the sensor functionality without moving it. The Self Test function is off when the self-test bit of CTRL_REG1 (control register 1) is programmed to `0`. When the self-test bit of ctrl_reg1 is programmed to `1` an actuation force is applied to the sensor, simulating a definite input acceleration. In this case the sensor outputs will exhibit a change in their DC levels which is related to the selected full scale through the device sensitivity. When Self Test is activated, the device output level is given by the algebraic sum of the signals produced by the acceleration acting on the sensor and by the electrostatic test-force. If the output signals change within the amplitude specified inside Table 3, than the sensor is working properly and the parameters of the interface chip are within the defined specification.
2.5.4
Click and Double Click recognition
The Click and Double Click recognition functions help to create man-machine interface with little software overload. The device can be configured to output an interrupt signal on dedicated pin when tapped in any direction. If the sensor is exposed to a single input stimulus it generates an interrupt request on inertial interrupt pin (INT1 and/or INT2). A more advanced feature allows to generate and interrupt request when a "double click" with programmable time between the two events enabling a "mouse button like" use. This function can be fully programmed by the user in terms of expected amplitude and timing of the stimuli.
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Functionality
LIS302DL
3
Functionality
The LIS302DL is a ultracompact, low-power, digital output 3-axis linear accelerometer packaged in a LGA package. The complete device includes a sensing element and an IC interface able to take the information from the sensing element and to provide a signal to the external world through an I2C/SPI serial interface.
3.1
Sensing element
A proprietary process is used to create a surface micro-machined accelerometer. The technology allows to carry out suspended silicon structures which are attached to the substrate in a few points called anchors and are free to move in the direction of the sensed acceleration. To be compatible with the traditional packaging techniques a cap is placed on top of the sensing element to avoid blocking the moving parts during the moulding phase of the plastic encapsulation. When an acceleration is applied to the sensor the proof mass displaces from its nominal position, causing an imbalance in the capacitive half-bridge. This imbalance is measured using charge integration in response to a voltage pulse applied to the sense capacitor. At steady state the nominal value of the capacitors are few pF and when an acceleration is applied the maximum variation of the capacitive load is in fF range.
3.2
IC interface
The complete measurement chain is composed by a low-noise capacitive amplifier which converts into an analog voltage the capacitive unbalancing of the MEMS sensor and by analog-to-digital converters. The acceleration data may be accessed through an I2C/SPI interface thus making the device particularly suitable for direct interfacing with a microcontroller. The LIS302DL features a Data-Ready signal (RDY) which indicates when a new set of measured acceleration data is available thus simplifying data synchronization in the digital system that uses the device. The LIS302DL may also be configured to generate an inertial Wake-Up and Free-Fall interrupt signal accordingly to a programmed acceleration event along the enabled axes. Both Free-Fall and Wake-Up can be available simultaneously on two different pins.
3.3
Factory calibration
The IC interface is factory calibrated for sensitivity (So) and Zero-g level (Off). The trimming values are stored inside the device by a non volatile memory. Any time the device is turned on, the trimming parameters are downloaded into the registers to be used during the normal operation. This allows the user to use the device without further calibration.
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LIS302DL
Application hints
4
Application hints
Figure 5. LIS302DL electrical connection
Vdd Vdd_IO
6
1
Y
Z
1
X
10uF
Top VIEW
6 8
13
100nF
8
13
TOP VIEW
SDA/SDI/SDO
Direction of the detectable accelerations
SCL/SPC
INT1
INT2
GND
Digital signal from/to signal controller.Signal's levels are defined by proper selection of Vdd_IO
The device core is supplied through Vdd line while the I/O pads are supplied through Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 F Al) should be placed as near as possible to the pin 6 of the device (common design practice). All the voltage and ground supplies must be present at the same time to have proper behavior of the IC (refer to Figure 5). It is possible to remove Vdd maintaining Vdd_IO without blocking the communication busses, in this condition the measurement chain is powered off. The functionality of the device and the measured acceleration data is selectable and accessible through the I2C/SPI interface.When using the I2C, CS must be tied high. The functions, the threshold the timing of the two interrupt pins (INT 1 and INT 2) can be completely programmed by the user though the I2C/SPI interface.
4.1
Soldering information
The LGA package is compliant with the ECOPACK, RoHS and "Green" standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020C. Leave "Pin#1 indicator" unconnected during soldering. Land pattern and soldering recommendation are available at www.st.com/mems
SDO
CS
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Digital interfaces
LIS302DL
5
Digital interfaces
The registers embedded inside the LIS302DL may be accessed through both the I2C and SPI serial interfaces. The latter may be SW configured to operate either in 3-wire or 4-wire interface mode. The serial interfaces are mapped onto the same pads. To select/exploit the I2C interface, CS line must be tied high (i.e connected to Vdd_IO). Table 8. Serial interface pin description
PIN description SPI enable I2C/SPI mode selection (1: I2C mode; 0: SPI enabled) I2C Serial Clock (SCL) SPI Serial Port Clock (SPC) I2C Serial Data (SDA) SPI Serial Data Input (SDI) 3-wire Interface Serial Data Output (SDO) SPI Serial Data Output (SDO)
Pin name CS SCL/SPC
SDA/SDI/SDO SDO
5.1
I2C serial interface
The LIS302DL I2C is a bus slave. The I2C is employed to write the data into the registers whose content can also be read back. The relevant I2C terminology is given in the table below. Table 9.
Term Transmitter Receiver Master Slave
Serial interface pin description
Description The device which sends data to the bus The device which receives data from the bus The device which initiates a transfer, generates clock signals and terminates a transfer The device addressed by the master
There are two signals associated with the I2C bus: the Serial Clock Line (SCL) and the Serial DAta line (SDA). The latter is a bidirectional line used for sending and receiving the data to/from the interface. Both the lines are connected to Vdd_IO through a pull-up resistor embedded inside the LIS302DL. When the bus is free both the lines are high. The I2C interface is compliant with Fast Mode (400 kHz) I2C standards as well as the normal mode.
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LIS302DL
Digital interfaces
5.1.1
I2C operation
The transaction on the bus is started through a START (ST) signal. A START condition is defined as a HIGH to LOW transition on the data line while the SCL line is held HIGH. After this has been transmitted by the Master, the bus is considered busy. The next byte of data transmitted after the start condition contains the address of the slave in the first 7 bits and the eighth bit tells whether the Master is receiving data from the slave or transmitting data to the slave. When an address is sent, each device in the system compares the first seven bits after a start condition with its address. If they match, the device considers itself addressed by the master. The Slave ADdress (SAD) associated to the LIS302DL is 001110xb. SDO pad can be used to modify less significant bit of the device address. If SDO pad is connected to voltage supply LSb is `1' (address 0011101b) else if SDO pad is connected to ground LSb value is `0' (address 0011100b). This solution permits to connect and address two different accelerometer to the same I2C lines. Data transfer with acknowledge is mandatory. The transmitter must release the SDA line during the acknowledge pulse. The receiver must then pull the data line LOW so that it remains stable low during the HIGH period of the acknowledge clock pulse. A receiver which has been addressed is obliged to generate an acknowledge after each byte of data has been received. The I2C embedded inside the LIS302DL behaves like a slave device and the following protocol must be adhered to. After the start condition (ST) a salve address is sent, once a slave acknowledge (SAK) has been returned, a 8-bit sub-address will be transmitted: the 7 LSb represent the actual register address while the MSB enables address auto increment. If the MSb of the SUB field is 1, the SUB (register address) will be automatically incremented to allow multiple data read/write. The slave address is completed with a Read/Write bit. If the bit was `1' (Read), a repeated START (SR) condition will have to be issued after the two sub-address bytes; if the bit is `0' (Write) the Master will transmit to the slave with direction unchanged. Table 10 explain how the SAD+read/write bit pattern is composed, listing all the possible configurations. Table 10. SAD+read/write patterns
SAD[6:1] 001110 001110 001110 001110 SAD[0] = SDO 0 0 1 1 R/W 1 0 1 0 SAD+R/W 00111001 (39h) 00111000 (38h) 00111011 (3Bh) 00111010 (3Ah)
Command Read Write Read Write
Table 11.
Master Slave
Transfer when master is writing one byte to slave
ST SAD + W SAK SUB SAK DATA SAK SP
Table 12.
Master Slave
Transfer when Master is writing multiple bytes to slave
ST SAD + W SAK SUB SAK DATA SAK DATA SAK SP
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Digital interfaces
LIS302DL
Table 13.
Master Slave ST
Transfer when master is receiving (reading) one byte of data from slave
SAD + W SAK SUB SAK SR SAD + R SAK DATA NMAK SP
Table 14.
Master Slave
Transfer when master is receiving (reading)
ST SAD + W SAK SUB SAK SR SAD + R SAK DATA MAK
Table 15.
Master Slave
Multiple bytes of data from slave
MAK DATA DATA NMAK SP
Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number of bytes transferred per transfer is unlimited. Data is transferred with the most significant bit (MSb) first. If a receiver can't receive another complete byte of data until it has performed some other function, it can hold the clock line, SCL LOW to force the transmitter into a wait state. Data transfer only continues when the receiver is ready for another byte and releases the data line. If a slave receiver doesn't acknowledge the slave address (i.e. it is not able to receive because it is performing some real time function) the data line must be left HIGH by the slave. The Master can then abort the transfer. A LOW to HIGH transition on the SDA line while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be terminated by the generation of a STOP (SP) condition. In order to read multiple bytes, it is necessary to assert the most significant bit of the subaddress field. In other words, SUB(7) must be equal to 1 while SUB(6-0) represents the address of first register to read. In the presented communication format MAK is Master Acknowledge and NMAK is No Master Acknowledge.
5.2
SPI bus interface
The LIS302DL SPI is a bus slave. The SPI allows to write and read the registers of the device. The Serial Interface interacts with the outside world with 4 wires: CS, SPC, SDI and SDO. Figure 6.
CS SPC SDI
RW MS AD5 AD4 AD3 AD2 AD1 AD0 DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
Read and write protocol
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
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LIS302DL
Digital interfaces CS is the serial port enable and it is controlled by the SPI master. It goes low at the start of the transmission and goes back high at the end. SPC is the Serial Port Clock and it is controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and SDO are respectively the Serial Port Data Input and Output. Those lines are driven at the falling edge of SPC and should be captured at the rising edge of SPC. Both the Read Register and Write Register commands are completed in 16 clock pulses or in multiple of 8 in case of multiple byte read/write. Bit duration is the time between two falling edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling edge of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just before the rising edge of CS.
bit 0: RW bit. When 0, the data DI(7:0) is written into the device. When 1, the data DO(7:0) from the device is read. In latter case, the chip will drive SDO at the start of bit 8. bit 1: MS bit. When 0, the address will remain unchanged in multiple read/write commands. When 1, the address will be auto incremented in multiple read/write commands. bit 2-7: address AD(5:0). This is the address field of the indexed register. bit 8-15: data DI(7:0) (write mode). This is the data that will be written into the device (MSb first). bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb first). In multiple read/write commands further blocks of 8 clock periods will be added. When MS bit is 0 the address used to read/write data remains the same for every block. When MS bit is 1 the address used to read/write data is incremented at every block. The function and the behavior of SDI and SDO remain unchanged.
5.2.1
SPI Read
Figure 7. SPI Read protocol
CS SPC SDI
RW MS AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
The SPI Read command is performed with 16 clock pulses. Multiple byte read command is performed adding blocks of 8 clock pulses at the previous one.
bit 0: READ bit. The value is 1. bit 1: MS bit. When 0 do not increment address, when 1 increment address in multiple reading. bit 2-7: address AD(5:0). This is the address field of the indexed register.
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Digital interfaces
LIS302DL
bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb first). bit 16-... : data DO(...-8). Further data in multiple byte reading. Figure 8.
CS SPC SDI
RW MS AD5 AD4 AD3 AD2 AD1 AD0
Multiple bytes SPI Read protocol (2 bytes example)
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 DO15 DO14 DO13 DO12 DO11 DO10 DO9 DO8
5.2.2
SPI Write
Figure 9.
CS SPC SDI
RW MS AD5 AD4 AD3 AD2 AD1 AD0 DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
SPI Write protocol
The SPI Write command is performed with 16 clock pulses. Multiple byte write command is performed adding blocks of 8 clock pulses at the previous one. bit 0: WRITE bit. The value is 0. bit 1: MS bit. When 0 do not increment address, when 1 increment address in multiple writing. bit 2 -7: address AD(5:0). This is the address field of the indexed register. bit 8-15: data DI(7:0) (write mode). This is the data that will be written inside the device (MSb first). bit 16-... : data DI(...-8). Further data in multiple byte writing.
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LIS302DL Figure 10. Multiple bytes SPI Write protocol (2 bytes example)
CS SPC SDI
RW MS AD5 AD4 AD3 AD2 AD1 AD0
Digital interfaces
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0 DI15 DI14 DI13 DI12 DI11 DI10 DI9 DI8
5.2.3
SPI Read in 3-wires mode
3-wires mode is entered by setting to 1 bit SIM (SPI Serial Interface Mode selection) in CTRL_REG2. Figure 11. SPI Read protocol in 3-wires mode
CS SPC SDI/O
RW MS AD5 AD4 AD3 AD2 AD1 AD0 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
The SPI Read command is performed with 16 clock pulses: bit 0: READ bit. The value is 1. bit 1: MS bit. When 0 do not increment address, when 1 increment address in multiple reading. bit 2-7: address AD(5:0). This is the address field of the indexed register. bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb first). Multiple read command is also available in 3-wires mode.
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Register mapping
LIS302DL
6
Register mapping
The table given below provides a listing of the 8 bit registers embedded in the device and the related address: Table 16. Register address map
Register address Name Reserved (do not modify) Who_Am_I Reserved (do not modify) Ctrl_Reg1 Ctrl_Reg2 Ctrl_Reg3 HP_filter_reset Reserved (do not modify) Status_Reg -OutX -OutY -OutZ Reserved (do not modify) FF_WU_CFG_1 FF_WU_SRC_1(ack1) FF_WU_THS_1 FF_WU_DURATION_1 FF_WU_CFG_2 FF_WU_SRC_2 (ack2) FF_WU_THS_2 FF_WU_DURATION_2 CLICK_CFG CLICK_SRC (ack) -CLICK_THSY_X CLICK_THSZ rw rw rw r rw rw rw r rw rw rw r r r r r r r r rw rw rw r r Type Hex 00-0E 0F 10-1F 20 21 22 23 24-26 27 28 29 2A 2B 2C 2D 2E-2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 011 1011 00000000 011 1100 00000000 011 0000 00000000 011 0001 00000000 011 0010 00000000 011 0011 00000000 011 0100 00000000 011 0101 00000000 011 0110 00000000 011 0111 00000000 011 1000 00000000 011 1001 00000000 Not used 010 0111 00000000 010 1000 010 1001 010 1010 010 1011 010 1100 010 1101 output Reserved output Not used output Not used Not used 010 0000 00000111 010 0001 00000000 010 0010 00000000 010 0011 dummy Dummy register Reserved 000 1111 00111011 Binary Reserved Dummy register Reserved Default Comment
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LIS302DL Table 16. Register address map (continued)
Register address Name CLICK_timelimit CLICK_latency CLICK_window Type Hex rw rw rw 3D 3E 3F Binary 011 1101 00000000 011 1110 00000000 011 1111 00000000 Default
Register mapping
Comment
Registers marked as Reserved must not be changed. The writing to those registers may cause permanent damages to the device. The content of the registers that are loaded at boot should not be changed. They contain the factory calibration values. Their content is automatically restored when the device is powered-up.
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Register description
LIS302DL
7
Register description
The device contains a set of registers which are used to control its behavior and to retrieve acceleration data. The registers address, made of 7 bits, is used to identify them and to write the data through serial interface.
7.1
WHO_AM_I (0Fh)
Table 17.
0
Register
0 1 1 1 0 1 1
Device identification register. This register contains the device identifier that for LIS302DL is set to 3Bh.
7.2
CTRL_REG1 (20h)
Table 18.
DR
Register
PD FS STP STM Zen Yen Xen
Table 19.
DR PD FS STP, STM Zen Yen Xen
Register description
Data rate selection. Default value: 0 (0: 100 Hz output data rate; 1: 400 Hz output data rate) Power Down Control. Default value: 0 (0: power down mode; 1: active mode) Full Scale selection. Default value: 0 (refer to Table 3 for typical full scale value) Self Test Enable. Default value: 0 (0: normal mode; 1: self test P, M enabled) Z axis enable. Default value: 1 (0: Z axis disabled; 1: Z axis enabled) Y axis enable. Default value: 1 (0: Y axis disabled; 1: Y axis enabled) X axis enable. Default value: 1 (0: X axis disabled; 1: X axis enabled)
DR bit allows to select the data rate at which acceleration samples are produced. The default value is 0 which corresponds to a data-rate of 100Hz. By changing the content of DR to "1" the selected data-rate will be set equal to 400Hz. PD bit allows to turn on the turn the device out of power-down mode. The device is in powerdown mode when PD= "0" (default value after boot). The device is in normal mode when PD is set to 1. STP, STM bit is used to activate the self test function. When the bit is set to one, an output change will occur to the device outputs (refer to Table 3 and 4 for specification) thus allowing to check the functionality of the whole measurement chain.
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LIS302DL
Register description Zen bit enables the generation of Data Ready signal for Z-axis measurement channel when set to 1. The default value is 1. Yen bit enables the generation of Data Ready signal for Y-axis measurement channel when set to 1. The default value is 1. Xen bit enables the generation of Data Ready signal for X-axis measurement channel when set to 1. The default value is 1.
7.3
CTRL_REG2 (21h)
Table 20.
SIM
Register
BOOT -FDS HP_FF_W HP_FF_W HP_coeff2 HP_coeff1 U2 U1
Table 21.
SIM BOOT FDS HP FF_WU2 HPFF_WU1 HP coeff2 HP coeff1
Register description
SPI Serial Interface Mode selection. Default value: 0 (0: 4-wire interface; 1: 3-wire interface) Reboot memory content. Default value: 0 (0: normal mode; 1: reboot memory content) Filtered Data Selection. Default value: 0 (0: internal filter bypassed; 1: data from internal filter sent to output register) High Pass filter enabled for FreeFall/WakeUp # 2. Default value: 0 (0: filter bypassed; 1: filter enabled) High Pass filter enabled for Free-Fall/Wake-Up #1. Default value: 0 (0: filter bypassed; 1: filter enabled) High pass filter cut-off frequency configuration. Default value: 00 (See table below)
SIM bit selects the SPI Serial Interface Mode. When SIM is `0' (default value) the 4-wire interface mode is selected. The data coming from the device are sent to SDO pad. In 3-wire interface mode output data are sent to SDA_SDI pad. BOOT bit is used to refresh the content of internal registers stored in the flash memory block. At the device power up the content of the flash memory block is transferred to the internal registers related to trimming functions to permit a good behavior of the device itself. If for any reason the content of trimming registers was changed it is sufficient to use this bit to restore correct values. When BOOT bit is set to `1' the content of internal flash is copied inside corresponding internal registers and it is used to calibrate the device. These values are factory trimmed and they are different for every accelerometer. They permit a good behavior of the device and normally they have not to be changed. At the end of the boot process the BOOT bit is set again to `0'. FDS bit enables (FDS=1) or bypass (FDS=0) the high pass filter in the signal chain of the sensor HP_coeff[2:1]. These bits are used to configure high-pass filter cut-off frequency ft.
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Register description Table 22. High pass filter cut-off frequency configuration.
ft (Hz) (DR=100 Hz) 2 1 0.5 0.25 ft (Hz) (DR=400 Hz) 8 4 2 1
LIS302DL
HP_coeff2,1 00 01 10 11
7.4
CTRL_REG3 [Interrupt CTRL register] (22h)
Table 23.
IHL
Register
PP_OD I2CFG2 I2CFG1 I2CFG0 I1CFG2 I1CFG1 I1CFG0
Table 24.
IHL PP_OD I2CFG2 I2CFG1 I2CFG0 I1CFG2 I1CFG1 I1CFG0
Register description
Interrupt active high, low. Default value 0. (0: active high; 1: active low) Push-pull/Open Drain selection on interrupt pad. Default value 0. (0: push-pull; 1: open drain) Data Signal on Int2 pad control bits. Default value 000. (see table below) Data Signal on Int1 pad control bits. Default value 000. (see table below)
Table 25.
Truth table
I1(2)_CFG1 0 0 1 1 0 1 I1(2)_CFG0 0 1 0 1 0 1 Int1(2) Pad GND FF_WU_1 FF_WU_2 FF_WU_1 or FF_WU_2 Data ready Click interrupt
I1(2)_CFG2 0 0 0 0 1 1
7.5
HP_FILTER_RESET (23h)
Dummy register. Reading at this address zeroes instantaneously the content of the internal high pass-filter. If the high pass filter is enabled all three axes are instantaneously set to 0g. This allows to overcome the settling time of the high pass filter.
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LIS302DL
Register description
7.6
STATUS_REG (27h)
Table 26.
ZXYOR
Register
ZOR YOR XOR ZYXDA ZDA YDA XDA
Table 27.
ZYXOR
Register description
X, Y and Z axis data overrun. Default value: 0 (0: no overrun has occurred; 1: new data has over written the previous one before it was read) Z axis data overrun. Default value: 0 (0: no overrun has occurred; 1: a new data for the Z-axis has overwritten the previous one) Y axis data overrun. Default value: 0 (0: no overrun has occurred; 1: a new data for the Y-axis has overwritten the previous one) X axis data overrun. Default value: 0 (0: no overrun has occurred; 1: a new data for the X-axis has overwritten the previous one) X, Y and Z axis new data available. Default value: 0 (0: a new set of data is not yet available; 1: a new set of data is available) Z axis new data available. Default value: 0 (0: a new data for the Z-axis is not yet available; 1: a new data for the Z-axis is available) Y axis new data available. Default value: 0 (0: a new data for the Y-axis is not yet available; 1: a new data for the Y-axis is available) X axis new data available. Default value: 0 (0: a new data for the X-axis is not yet available; 1: a new data for the X-axis is available)
ZOR
YOR
XOR ZYXDA ZDA
YDA
XDA
7.7
OUT_X (29h)
Table 28.
XD7
Register
XD6 XD5 XD4 XD3 XD2 XD1 XD0
X axis output data.
7.8
OUT_Y (2Bh)
Table 29.
YD7
Register description
YD6 YD5 YD4 YD3 YD2 YD1 YD0
Y axis output data.
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Register description
LIS302DL
7.9
OUT_Z (2Dh)
Table 30.
ZD7
Register
ZD6 ZD5 ZD4 ZD3 ZD2 ZD1 ZD0
Z axis output data.
7.10
FF_WU_CFG_1 (30h)
Table 31.
AOI
Register
LIR ZHIE ZLIE YHIE YLIE XHIE XLIE
Table 32.
AOI
Register desccription
And/or combination of Interrupt events. Default value: 0 (0: OR combination of interrupt events; 1: AND combination of interrupt events) Latch Interrupt request into FF_WU_SRC reg with the FF_WU_SRC reg cleared by reading FF_WU_SRC_1 reg. Default value: 0 (0: interrupt request not latched; 1: interrupt request latched) Enable interrupt generation on Z high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable interrupt generation on Z low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Enable interrupt generation on Y high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable interrupt generation on Y low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Enable interrupt generation on X high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable interrupt generation on X low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold)
LIR
ZHIE
ZLIE
YHIE
YLIE
XHIE
XLIE
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LIS302DL
Register description
7.11
FF_WU_SRC_1 (31h)
Table 33.
X
Register
IA ZH ZL YH YL XH XL
Table 34.
IA ZH ZL YH YL XH XL
Register description
Interrupt active. Default value: 0 (0: no interrupt has been generated; 1: one ore more interrupt has been generated) Z high. Default value: 0 (0: no interrupt, 1: ZH event has occurred) Z low. Default value: 0 (0: no interrupt; 1: ZL event has occurred) Y high. Default value: 0 (0: no interrupt, 1: YH event has occurred) Y low. Default value: 0 (0: no interrupt, 1: YL event has occurred) X high. Default value: 0 (0: no interrupt, 1: XH event has occurred) X low. Default value: 0 (0: no interrupt, 1: XL event has occurred)
Free-fall and wake-up source register. Read only register. Reading at this address clears FF_WU_SRC_1 register and the FF, WU 1 interrupt and allows the refreshment of data in the FF_WU_SRC_1 register if the latched option was chosen.
7.12
FF_WU_THS_1 (32h)
Table 35.
DCRM
Register
THS6 THS5 THS4 THS3 THS2 THS1 THS0
Table 36.
DCRM
Register description
Resetting mode selection. Default value: 0 (0: counter resetted; 1: counter decremented) Free-fall / wake-up Threshold: default value: 000 0000
THS6, THS0
Most significant bit (DCRM) is used to select the resetting mode of the duration counter. If DCRM=0 counter is resetted when the interrupt is no more active else if DCRM=1 duration counter is decremented.
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Register description
LIS302DL
7.13
FF_WU_DURATION_1 (33h)
Table 37.
D7
Register
D6 D5 D4 D3 D2 D1 D0
Table 38.
D7-D0
Register description
Duration value. Default value: 0000 0000
Duration register for Free-Fall/Wake-Up interrupt 1. Duration step and maximum value depend on the ODR chosen. Step 2.5 msec, from 0 to 637.5 msec if ODR=400Hz, else step 10 msec, from 0 to 2.55 sec when ODR=100Hz. The counter used to implement duration function is blocked when LIR=1 in configuration register and the interrupt event is verified
7.14
FF_WU_CFG_2 (34h)
Table 39.
AOI
Register
LIR ZHIE ZLIE YHIE YLIE XHIE XLIE
Table 40.
AOI LIR
Register description
And/or combination of Interrupt events. Default value: 0 (0: OR combination of interrupt events; 1: AND combination of interrupt events) Latch interrupt request into FF_WU_SRC reg with the FF_WU_SRC reg cleared by reading FF_WU_SRC_2 reg. Default value: 0 (0: interrupt request not latched; 1: interrupt request latched) Enable interrupt generation on Z high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable interrupt generation on Z low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Enable interrupt generation on Y high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable interrupt generation on Y low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Enable interrupt generation on X high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable interrupt generation on X low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold)
ZHIE
ZLIE
YHIE
YLIE
XHIE
XLIE
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LIS302DL
Register description
7.15
FF_WU_SRC_2 (35h)
Table 41.
X
Register
IA ZH ZL YH YL XH XL
Table 42.
IA
Register description
Interrupt active. Default value: 0 (0: no interrupt has been generated; 1: one or more interrupt event has been generated) Z high. Default value: 0 (0: no interrupt; 1: ZH event has occurred)
ZH
ZL YH YL XH XL
Z low. Default value: 0 (0: no interrupt; 1: ZL event has occurred) Y high. Default value: 0 (0: no interrupt; 1: YH event has occurred) Y low. Default value: 0 (0: no interrupt; 1: YL event has occurred) X high. Default value: 0 (0: no interrupt; 1: XH event has occurred) X low. Default value: 0 (0: no interrupt; 1: XL event has occurred)
Free-fall and wake-up source register. Read only register. Reading at this address clears FF_WU_SRC_2 register and the FF, WU 2 interrupt and allows the refreshment of data in the FF_WU_SRC_2 register if the latched option was chosen.
7.16
FF_WU_THS_2 (36h)
Table 43.
DCRM
Register
THS6 THS5 THS4 THS3 THS2 THS1 THS0
Table 44.
DCRM THS6, THS0
Register description
Resetting mode selection. Default value: 0 (0: counter resetted; 1: counter decremented) Free-fall / wake-up Threshold. Default value: 000 0000
Most significant bit (DCRM) is used to select the resetting mode of the duration counter. If DCRM=0 counter is resetted when the interrupt is no more active else if DCRM=1 duration counter is decremented.
7.17
FF_WU_DURATION_2 (37h)
Table 45.
D7
Register
D6 D5 D4 D3 D2 D1 D0
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Register description Table 46. D7-D0 Register description Duration value. Default value: 0000 0000
LIS302DL
Duration register for Free-Fall/Wake-Up interrupt 2. Duration step and maximum value depend on the ODR chosen. Step 2.5 msec, from 0 to 637.5 msec if ODR=400Hz, else step 10 msec, from 0 to 2.55 sec when ODR=100Hz. The counter used to implement duration function is blocked when LIR=1 in configuration register and the interrupt event is verified.
7.18
CLICK_CFG (38h)
Table 47.
-
Register
LIR Double_Z Single_Z Double_Y Single_Y Double_X Single_X
Table 48. LIR
Register description Latch interrupt request into CLICK_SRC reg with the CLICK_SRC reg refreshed by reading CLICK_SRC reg. Default value: 0 (0: interrupt request not latched; 1: interrupt request latched) Enable interrupt generation on double click event on Z axis. Default value: 0 (0: disable interrupt request; 1: enable interrupt request) Enable interrupt generation on single click event on Z axis. Default value: 0 (0: disable interrupt request; 1: enable interrupt request) Enable interrupt generation on double click event on Y axis. Default value: 0 (0: disable interrupt request; 1: enable interrupt request) Enable interrupt generation on single click event on Y axis. Default value: 0 (0: disable interrupt request; 1: enable interrupt request) Enable interrupt generation on double click event on X axis. Default value: 0 (0: disable interrupt request; 1: enable interrupt request) Enable interrupt generation on single click event on X axis. Default value: 0 (0: disable interrupt request; 1: enable interrupt request) Truth table
Single_Z / Y / X 0 1 0 1 Click output 0 Single Double Single or double
Double_Z Single_Z Double_Y Single_Y Double_X Single_X
Table 49.
Double_Z / Y / X 0 0 1 1
7.19
CLICK_SRC (39h)
Table 50.
X
Register
IA Double_Z Single_Z Double_Y Single_Y Double_X Single_X
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LIS302DL Table 51.
IA
Register description Register description
Interrupt active. Default value: 0 (0: no interrupt has been generated; 1: one or more interrupt event has been generated) Double click on Z axis event. Default value: 0 (0: no interrupt; 1: Double Z event has occurred) Single click on Z axis event. Default value: 0 (0: no interrupt; 1: Single Z event has occurred) Double click on Y axis event. Default value: 0 (0: no interrupt; 1: Double Y event has occurred) Single click on Y axis event.Default value: 0 (0: no interrupt; 1: Single Y event has occurred) Double click on X axis event. Default value: 0 (0: no interrupt; 1: Double X event has occurred) Single click on X axis event. Default value: 0 (0: no interrupt; 1: Single X event has occurred)
Double_Z Single_Z Double_Y Single_Y Double_X Single_X
7.20
CLICK_THSY_X (3Bh)
Table 52.
THSy3
Register
THSy2 THSy1 THSy0 THSx3 THSx2 THSx1 THSx0
Table 53.
Register description
THSy3-THSy0 Click threshold on Y axis. Default value: 0000 THSx3-THSx0 Click threshold on X axis. Default value: 0000
From 0.5g(0001) to 7.5g(1111) with step of 0.5g.
7.21
CLICK_THSZ (3Ch)
Table 54.
X
Register
X X X THSz3 THSz2 THSz1 THSz0
Table 55.
Register description
THSz3-THSz0 Click Threshold on Z axis. Default value: 0000
From 0.5g(0001) to 7.5g(1111) with step of 0.5g.
7.22
CLICK_TimeLimit (3Dh)
Table 56.
Dur7
Register
Dur6 Dur5 Dur4 Dur3 Dur2 Dur1 Dur0
From 0 to 127.5msec with step of 0.5 msec,
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Register description
LIS302DL
7.23
CLICK_Latency (3Eh)
Table 57.
Lat7
Register
Lat6 Lat5 Lat4 Lat3 Lat2 Lat1 Lat0
From 0 to 255 msec with step of 1 msec.
7.24
CLICK_Window (3Fh)
Table 58.
Win7
Register
Win6 Win5 Win4 Win3 Win2 Win1 Win0
From 0 to 255 msec with step of 1 msec.
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LIS302DL
Typical performance characteristics
8
8.1
Typical performance characteristics
Mechanical characteristics at 25C
Figure 13. X axis sensitivity at 2.5V
15
Figure 12. X axis 0-g level at 2.5V
30
25
15
10
Percent of parts [%]
-100 -50 0 50 Zero-g Level Offset [mg] 100 150
Percent of parts [%]
20
10
5
5
0 -150
0 16
16.5
17
17.5 18 18.5 Sensitivity [mg/digits]
19
19.5
20
Figure 14. Y axis 0-g level at 2.5V
30
Figure 15. Y axis sensitivity at 2.5V
14
25
12
10 Percent of parts [%] Percent of parts [%] -100 -50 0 50 Zero-g Level Offset [mg] 100 150 20
8
15
6
10
4
5
2
0 -150
0 16
16.5
17
17.5 18 18.5 Sensitivity [mg/digits]
19
19.5
20
Figure 16. Z axis 0-g level at 2.5V
25
Figure 17. Z axis sensitivity at 2.5V
15
20
Percent of parts [%]
15
10
Percent of parts [%] -100 -50 0 50 Zero-g Level Offset [mg] 100 150
10
5
5
0 -150
0 16
16.5
17
17.5 18 18.5 Sensitivity [mg/digits]
19
19.5
20
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Typical performance characteristics
LIS302DL
8.2
Mechanical characteristics derived from measurement in the -40C to +85C temperature range
Figure 19. X axis Sensitivity change vs temperature at 2.5V
60
Figure 18. X axis 0-g level change vs temperature at 2.5V
35 30 25 20 15 10 5 0 -3
50 Percent of parts (%) -2 -1 0 1 0-g level drift (mg/C) 2 3
Percent of parts (%)
40
30
20
10
0 -0.05
0 sensitivity drift (%/deg. C)
0.05
Figure 20. Y axis 0-g level change vs temperature at 2.5V
35 30 25 20 15 10 5 0 -3
Figure 21. Y axis sensitivity change Vs temperature at 2.5V
60
50 Percent of parts (%) -2 -1 0 1 0-g level drift (mg/ C) 2 3
Percent of parts (%)
40
30
20
10
0 -0.05
0 sensitivity drift (%/deg. C)
0.05
Figure 22. Z axis 0-g level change vs temperature at 2.5V
35 30 25 20 15 10 5 0 -2
Figure 23. Z axis sensitivity change vs temperature at 2.5V
60
50 Percent of parts (%) -1 0 1 2 0-g level drift (mg/C) 3 4
Percent of parts (%)
40
30
20
10
0 -0.05
0 sensitivity drift (%/deg. C)
0.05
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LIS302DL
Typical performance characteristics
8.3
Electro-mechanical characteristics at 25C
Figure 25. Current consumption in power down mode at 2.5V
35
25
Figure 24. Current consumption in normal mode at 2.5V
30
30
20
Percent of parts [%]
Percent of parts (%)
25 20 15 10 5 0 -1
15
10
5
0 200
0
220
240
260
280 300 320 340 Current consumption [uA]
360
380
400
1 2 3 current consumption (uA)
4
5
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Package information
LIS302DL
9
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 26. LGA 14: Mechanical data and package dimensions
mm DIM. MIN. A1 A2 A3 D1 E1 e d L1 N N1 P1 P2 T1 T2 R h k i s 0.965 0.640 0.750 0.450 1.200 0.150 0.050 0.100 0.100 0.180 2.850 4.850 0.220 3.000 5.000 0.800 0.300 4.000 1.360 1.200 0.975 0.650 0.800 0.500 TYP. 0.920 MAX. 1.000 0.700 MIN. TYP. MAX. 0.0362 0.0394 0.0275 inch
OUTLINE AND MECHANICAL DATA
0.260 0.0071 0.0087 0.0102 3.150 0.1122 0.1181 0.1240 5.150 0.1909 0.1968 0.2027 0.0315 0.0118 0.1575 0.0535 0.0472 0.985 0.0380 0.0384 0.0386 0.660 0.0252 0.0256 0.0260 0.850 0.0295 0.0315 0.0335 0.550 0.0177 0.0197 0.0217 1.600 0.0472 0.0059 0.0020 0.0039 0.0039 0.0630
LGA14 (3x5x0.92mm) Pitch 0.8mm Land Grid Array Package
7773587 C
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LIS302DL
Revision history
10
Revision history
Table 59.
Date 3-Oct-2006 6-Feb-2007 25-Oct-2007
Document revision history
Revision 1 2 3 Initial release. Added functions and registers information and typical performance characteristics Added interfaces timing characteristics and global datasheet review to improved readability Changes
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LIS302DL
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